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40MX and 42MX FPGA Families
ii
v6.0
Ordering Information
Plastic Device Resources
_
Part Number
Speed Grade
Package Type
Package Lead Count
Blank = Commercial (0 to +70˚C)
I
=
Industrial (–40 to +85˚C)
M
=
Military (–55 to +125˚C)
B
=
MIL-STD-883
A
=
Automotive (–40 to +125˚C)
Application (Temperature Range)
PL
=
Plastic Leaded Chip Carrier
PQ =
Plastic Quad Flat Pack
TQ =
Thin (1.4 mm) Quad Flat Pack
VQ =
Very Thin (1.0 mm) Quad Flat Pack
BG =
Plastic Ball Grid Array
CQ =
Ceramic Quad Flat Pack
Blank = Standard Speed
–1
=
Approximately 15% Faster than Standard
–2
=
Approximately 25% Faster than Standard
–3
=
Approximately 35% Faster than Standard
–F
=
Approximately 40% Slower than Standard
A40MX02
=
3,000 System Gates
A40MX04
=
6,000 System Gates
A42MX09
=
14,000 System Gates
A42MX16
=
24,000 System Gates
A42MX24
=
36,000 System Gates
A42MX36
=
54,000 System Gates
A42MX16
1
PQ
100
ES
User I/Os
Device
PLCC
44-Pin
PLCC
68-Pin
PLCC
84-Pin
PQFP
100-Pin
PQFP
160-Pin
PQFP
208-Pin
PQFP
240-Pin
VQFP
80-Pin
VQFP
100-Pin
TQFP
176-Pin
PBGA
272-Pin
A40MX02
34
57
–
57
–
–
–
57
–
–
–
A40MX04
34
57
69
69
–
–
–
69
–
–
–
A42MX09
–
–
72
83
101
–
–
–
83
104
–
A42MX16
–
–
72
83
125
140
–
–
83
140
–
A42MX24
–
–
72
–
125
176
–
–
–
150
–
A42MX36
–––––
176
202
––
–
202
Note: Package Definitions
PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad Flat Pack,
PBGA = Plastic Ball Grid Array