Electronic Components Datasheet Search |
|
TRF1123 Datasheet(PDF) 9 Page - Texas Instruments |
|
TRF1123 Datasheet(HTML) 9 Page - Texas Instruments |
9 / 11 page www.ti.com 3.80 0.25 TYP 0.50 TYP SOLDER MASK: NO SOLDERMASK UNDER CHIP, ON LEAD PADS OR ON GROUND CONNECTIONS. 25 VIA HOLES, EACH 0.38 mm. DIMENSIONS in mm DIA 0.38 TYP 0.60 TYP 3.80 3.50 3.50 0.20 TYP 0.75 TYP 0.75 TYP PIN 1 TRF1123 SLWS167A – APRIL 2005 – REVISED JULY 2005 Table 2. PCB Recommendations (continued) Prepreg Thickness 8 mil Recommended Number of Layers 4 Via Plating Thickness 0.5 oz Final Plate White immersion tin Final Board Thickness 33-37 mil Figure 11. Recommended Pad Layout 9 |
Similar Part No. - TRF1123 |
|
Similar Description - TRF1123 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |