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CY7C1378B
Document #: 38-05435 Rev. *A
Page 9 of 14
AC Test Loads and Waveforms
Thermal Resistance[11]
Parameter
Description
Test Conditions
TQFP
Package.
Unit
ΘJA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard test methods and
procedures for measuring thermal impedance, per
EIA/JESD51
25
°C/W
ΘJC
Thermal Resistance
(Junction to Case)
9
°C/W
Capacitance[11]
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
VDD = 3.3V,
VDDQ = 3.3V
5
pF
CCLK
Clock Input Capacitance
5
pF
CI/O
Input/Output Capacitance
5
pF
Note:
11. Tested initially and after any design or process changes that may affect these parameters.
OUTPUT
R = 317
Ω
R = 351
Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
RL = 50Ω
Z0 = 50Ω
VL = 1.5V
3.3V
ALL INPUT PULSES
VDD
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
3.3V I/O Test Load
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