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B048F120M20 Datasheet(PDF) 1 Page - Vicor Corporation |
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B048F120M20 Datasheet(HTML) 1 Page - Vicor Corporation |
1 / 16 page Vicor Corporation Tel: 800-735-6200 V•I Chip Bus Converter B048K120T20 Rev. 2.2 Page 1 of 16 vicorpower.com 45 45 Product Description The V•I Chip Bus Converter Module (BCM) is a high efficiency (>96%), narrow input range Voltage Transformation Module (VTM) operating from a 48 Vdc bus to deliver an isolated 12 V secondary for Intermediate Bus Architecture applications. The BCM may be used to power non-isolated POL converters or as an independent 12 V source. Due to the fast response time and low noise of the BCM, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced—or eliminated— resulting in savings of board area, materials and total system cost. The BCM achieves a power density of 800 W/in 3 and may be surface mounted with a profile as low as 0.16" (4mm) over the PCB. Its V•I Chip power package is compatible with on-board or in-board surface mounting. The V•I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM does not require a discrete heat sink in typical applications. It is also compatible with heat sink options, assuring low junction temperatures and long life in the harshest environments. Absolute Maximum Ratings Parameter Values Unit Notes +In to -In -1.0 to 60.0 Vdc +In to -In 100 Vdc For 100 ms PC to -In -0.3 to 7.0 Vdc TM to -In -0.3 to 7.0 Vdc +Out to -Out -0.5 to 15.0 Vdc Isolation voltage 2250 Vdc Input to Output Operating junction temperature -40 to 125 °C T grade; See note 2 Output current 17.0 A Continuous Peak output current 25 A For 1 ms Case temperature during reflow 208 °C Storage temperature -40 to 150 °C Output power 200 W Continuous Peak output power 300 W For 1 ms Thermal Resistance Symbol Parameter Typ Max Units R θJC Junction-to-case 1.1 1.5 °C/W R θJB Junction-to-BGA 2.1 2.5 °C/W R θJA Junction-to-ambient 3 6.5 7.2 °C/W R θJA Junction-to-ambient 4 5.0 5.5 °C/W • 48 V to 12 V V•I Chip Converter • 200 Watt (300 Watt for 1 ms) •High density – up to 800 W/in3 •Small footprint – 200 W/in2 • Low weight – 0.5 oz (14 g) • ZVS/ZCS isolated sine amplitude converter • >96% efficiency • 125°C operation •1 µs transient response • >3.5 million hours MTBF • No output filtering required • BGA or J-Lead packages B048K120T20 1 + – V•I K + – Vin = 42 - 53 V Vout = 10.5 - 13.25 V Iout = 17.0 A K = 1/4 Rout = 25 m Ω max Notes 1. For complete product matrix see chart on page 10. 2. The referenced junction is defined as the semiconductor having the highest temperature. This temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator. 3. B048K120T20 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM. 4. B048L120T20 (0.25"H optional Pin Fins) surface mounted on FR4 board, 300 LFM. Actual size © V•I ChipTM – BCM Bus Converter Module |
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