PLATED THRU HOLE

FOR STANDOFF MTG

3,30

± 0,08

4 x ø 0.130

± 0.003

17,78

0.700

25,4

1.000

35,56

1.400

10,16

0.400

48,26

± 0,05

1.900

± 0.002

1,59

0.063

48,26

1.900

3,18

± 0,05

2 x 0.125

± 0.002

40,64

1.600

7,62

0.300

1,59

0.063

6,35

0.250

6,36

0.250

13,61

0.536

53,24

2.096

2,47

0.097

13,61

0.536

6,36

0.251

DETAIL A

(MIRROR IMAGE TO OTHER SIDE)

ALL DIMENSIONS IN INCHES

SEE DETAIL B

SEE DETAIL A

PCB

2

43

1

9

8

7

6

5

PCB MOUNTING SPECIFICATIONS

(ALSO SEE EXCHANGE TOOL DETAILS IN RIGHT VIEWS)

PRODUCT APPLICATION SPECIFICATIONS

1,63

±0,08

(#52 DRILL)

6 x ø0.064

± 0.003

DETAIL B

(MIRROR IMAGE TO OTHER SIDE)

ALL DIMENSIONS IN INCHES

15

°

11,18

0.440

50,8

2.000

61,72

2.430

6,73

0.265

7,62

0.300

20,3

± 0,8

0.80

± 0.03

3,8

0.15

50,3

1.98

1,6

0.06

9,5

0.38

31,6

1.25

12,47

0.491

MAX

0.56

0,15

0.006

20,3

0.80

SURFMATE INPUT

CONNECTOR

PCB

MODULE

1

2

3

1

3

4

56

7

8

9

2

MODULE

EXCHANGE

TOOL

MODULE

EXCHANGE

TOOL-

BOTH ENDS

(PARTIAL)

MODULE

BASEPLATE

PCB

SURFMATE OUTPUT

CONNECTOR

DETAIL C

REF

BOTTOM OF

CAP TO TOP

OF PCB

EXCHANGE TOOL

HOOK AREA, 4 PLCS

(BOTH ENDS-SEE VIEWS)

38

°

55

°

0.131

0.467

0.027

0.230

0.115

0.159

0.318

0.034

0.604

0.027

0.277

TYP

0.230

0.065

0.115

0.340

0.202

TYP

0.050

0.027

TYP

0.050

0.027

0.027

0.340

0.226

0.328

0.265

0.254

0.065

0.138

TYP

0.050

TYP

0.050

0.034

0.065

0.027

0.027

0.027

FREE OF SOLDER MASK

SOLDER MASK KEEP-OUT AREA

EXCEPT ON PADS

SOLDER MASK KEEP-OUT AREA

EXCEPT ON PADS

FREE OF SOLDER MASK

3 VIA HOLES

Ø 0.032

± 0.003

29 VIA HOLES

Ø 0.032

± 0.003

2 x Ø 0.316

7 x Ø 0.233

16 VIA HOLES

Ø 0.032

± 0.003

3 VIA HOLES

Ø 0.032

± 0.003

7 PL

Ø 0.016 NON PLATED THRU

7 x Ø 0.016

0.266

0.069

0.313

0.102

0.266

0.069

0.350

0.152

All dimensions are Inch or Inch / Metric

ANSI / IPC-D-300 specifications apply for Class “B” boards.

Recommended PCB construction:

Multilayer 3oz Cu with internal power and ground planes. Pad geometry and minimum number

of via holes for connection to power and ground planes shown in Details “A” & “B” for high

current applications. Pads to be covered with solder mask except in circular area shown in

Detail “A” & “B”. Final pad height above laminate to be 0.004" +/- 0.0004".

Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).

Pin

Symbol

Function

Symbol

Function

Pin Dia.

Number

(Inches / mm)

1

+

+IN

N

Neutral

0.080 / 2,03

2

PC

Prim. Control EMI GRD

EMI

0.080 / 2,03

3

PR

Parallel

NC

0.080 / 2,03

4

––IN

L

Line

0.080 / 2,03

5

––OUT

–– Out

0.150 / 3,81

6

–S

– Sense

EN

Enable

0.080 / 2,03

7

SC

Sec. Control

ST

Strap

0.080 / 2,03

8

+S

+Sense

BOK

BUS OK

0.080 / 2,03

9

+

+Out

+

+ OUT

0.150 / 3,81

PIN LEGEND

Mini

FARM

PCB Layout Drawing

for Mini Size Module