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HDSP-S51Z-HH000 Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard) |
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HDSP-S51Z-HH000 Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard) |
8 / 12 page 8 Absolute Maximum Ratings at TA = 25˚C GaP Red GaP Green Parameter HDSP-S51E/S56E/B51Z/B56Z HDSP-S51G/S56G/B51Z/B56Z Units Average Power per Dot[1] 65 65 mW Peak Forward Current per Dot[1] (1/8 Duty Cycle at 10 KHz) 80 100 mA Average Forward Current per Dot 25[1,2] 25[1,3] mA Reverse Voltage per Dot 3 3 V Operating Temperature –35 to +85 –35 to +85 °C Storage Temperature –35 to +85 –35 to +85 °C Lead Solder Temperature for 3 seconds[4] (2 mm [0.078 in.] below seating plane) 260 260 °C Notes: 1. Do not exceed maximum average current per dot. 2. Derate above 25 °C at 0.20 mA/°C. 3. Derate above 25 °C at 0.33 mA/°C. 4. Not recommended to be soldered more than 2 times. Minimum interval between solderings is 15 minutes. Total soldering time not to exceed 3 seconds. |
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Similar Description - HDSP-S51Z-HH000 |
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