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MR16R1624AF0-CM8 Datasheet(PDF) 7 Page - Samsung semiconductor

Part # MR16R1624AF0-CM8
Description  (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

MR16R1624AF0-CM8 Datasheet(HTML) 7 Page - Samsung semiconductor

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Version 1.4 July 2002
MR16R1622(4/8/G)AF0
MR18R1622(4/8/G)AF0(1)
Absolute Maximum Ratings
DC Recommended Electrical Conditions
Table 4: Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
VI,ABS
Voltage applied to any RSL or CMOS signal pad with respect to Gnd
- 0.3
VDD + 0.3
V
VDD,ABS
Voltage on VDD with respect to Gnd
- 0.5
VDD + 1.0
V
TSTORE
Storage temperature
- 50
100
°C
TPLATE
Plate temperature
-
92
°C
Table 5: DC Recommended Electrical Conditions
Symbol
Parameter and Conditions
Min
Max
Unit
VDD
Supply voltage
2.50 - 0.13
2.50 + 0.13
V
VCMOS
CMOS I/O power supply at pad for 2.5V controllers:
CMOS I/O power supply at pad for 1.8V controllers:
VDD
1.8 - 0.1
VDD
1.8 + 0.2
V
V
VREF
Reference voltage
1.4 - 0.2
1.4 + 0.2
V
VSPD
Serial Presence Detector- Positive power supply
2.2
3.6
V
Table 6: RIMM Module Capacity and Number of RDRAM device
RIMM Module Capacity:
512/576MB
256/288MB
128/144MB
64/72MB
Number of 256/288Mb RDRAM devices
16
8
4
2


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