Am29LV065M

5

ADV ANCE

I N FO RMAT I O N

CONNECTION DIAGRAMS

Special Handling Instructions for FBGA

Package

Special handling is required for Flash Memory products

in FBGA packages.

Flash memory devices in FBGA packages may be

damaged if exposed to ultrasonic cleaning methods.

The package and/or data integrity may be compromised

if the package body is exposed to temperatures above

150

°C for prolonged periods of time.

C2

D2

C3

D3

E2

E3

F2

F3

G2

G3

H2

H3

J2

J3

K2

A3

A4

A2

A1

A0

CE#

OE#

A7

A18

A6

A5

DQ0

NC

NC

DQ1

RY/BY#

ACC

NC

NC

DQ2

DQ3

A21

WE#

RESET#

A22

NC

DQ5

NC

DQ4

A9

A8

A11

A12

A19

A10

DQ6

DQ7

A14

A13

A15

A16

A17

NC

A20

C4

D4

E4

A1

B1

A2

NC*

NC*

NC*

F4

G4

H4

J4

K4

C5

D5

E5

F5

G5

H5

J5

K5

C6

D6

E6

F6

G6

H6

J6

K6

C7

D7

E7

NC*

NC*

NC*

NC*

A7

B7

A8

B8

F7

G7

H7

J7

K7

NC*

NC*

NC*

NC*

L7

M7

L8

M8

K3

L1

L2

M1

NC*

NC*

NC*

NC*

M2

* Balls are shorted together via the substrate but not connected to the die.

63-Ball FBGA

Top View, Balls Facing Down