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ABSOLUTE MAXIMUM RATINGS

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DISSIPATION RATINGS TABLE PER PACKAGE

THS4511

SLOS471 – SEPTEMBER 2005

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated

circuits be handled with appropriate precautions. Failure to observe proper handling and installation

procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

over operating free-air temperature range (unless otherwise noted)

UNIT

Supply voltage

5.5 V

Input voltage

Differential input voltage

4 V

Output current

200 mA

Continuous power dissipation

See Dissipation Rating Table

150°C

125°C

Operating free-air temperature range

–40°C to 85°C

Storage temperature range

–65°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300°C

HBM

2000 V

ESD ratings

CDM

1500 V

MM

100 V

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Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

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The absolute maximum temperature under any condition is limited by the constraints of the silicon process.

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The maximum junction temperature for continuous operation is limited by the package constraints. Operation above this temperature

may result in reduced reliability and/or lifetime of the device. The THS4511 incorporates a (QFN) exposed thermal pad on the underside

of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so

may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief

SLMA002 and SLMA004 for more information about utilizing the QFN thermally enhanced package.

POWER RATING

θ

JC

θ

JA

RGT (16)

2.4°C/W

39.5°C/W

2.3 W

225 mW

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For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

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