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MM908E622ACDWB Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc

Part # MM908E622ACDWB
Description  Integrated Quad Half-Bridge, Triple High-Side and EC Glass Driver with Embedded MCU and LIN for High End Mirror
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MM908E622ACDWB Datasheet(HTML) 6 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
6
Freescale Semiconductor
908E622
Maximum Ratings
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent
damage to the device.
Rating
Symbol
Value
Unit
Electrical Ratings
Supply Voltage
Analog Chip Supply Voltage under Normal Operation (Steady-State)
Analog Chip Supply Voltage under Transient Conditions (1)
MCU Chip Supply Voltage
VSUP(SS)
VSUP(PK)
VDD
-0.3 to 28
-0.3 to 40
-0.3 to 5.5
V
Input Terminal Voltage
Analog Chip
Microcontroller Chip
VIN(ANALOG)
VIN(MCU)
-0.3 to 5.5
VSS-0.3 to VDD+0.3
V
Maximum Microcontroller Current per Terminal
All Terminals except VDD, VSS, PTA0:PTA4
PTA0:PTA4
IPIN(1)
IPIN(2)
±15
±25
mA
Maximum Microcontroller VSS Output Current
IMVSS
100
mA
Maximum Microcontroller VDD Input Current
IMVDD
100
mA
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Input Voltage (per ISO7637 Specification) and with
External Components (Figure 4, page 18)
VBUS(SS)
VBUS(PK)
-18 to 40
-150 to 100
V
ESD Voltage
Human Body Model (2) H0 terminal
Human Body Model (2) all other terminals
Machine Model (3)
Charge Device Model (4)
VESD1-1
VESD1-2
VESD2
VESD3
±1000
±2000
±200
±750
V
Notes
1.
Transient capability for pulses with a time of t < 0.5 sec.
2.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP =1500 Ω).
3.
ESD2 testing is performed in accordance with the Machine Model (CZAP =200 pF, RZAP =0 Ω).
4.
ESD3 testing is performed in accordance with Charge Device Model, Robotic (CZAP =4.0 pF).


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