Electronic Components Datasheet Search |
|
48SD3208RPFI Datasheet(PDF) 11 Page - Maxwell Technologies |
|
48SD3208RPFI Datasheet(HTML) 11 Page - Maxwell Technologies |
11 / 39 page 48SD3208 11 All data sheets are subject to change without notice ©2005 Maxwell Technologies All rights reserved. 256Mb (8-Meg X 8-Bit X 4-Banks) SDRAM 01.10.05 Rev 2 ACTIVE clock suspend: This suspend mode ignores inputs after the next clock by internally maintaining the bank active status. READ suspend and READ with Auto-precharge suspend: The data being output is held ( and continues to be output). WRITE suspend and WRIT with Auto-precharge suspended: In this mode, external signals are not accepted. However, the internal state is held. Clock suspend: During clock suspend mode, keep the CKE to Low. Clock suspend mode exit: The SDRAM exits from clock suspend mode by setting CKE to High during the clock suspend state. IDLE: In this state, all banks are not selected, and have completed precharge operation. Auto-refresh command (REF): When this command is input from the IDLE state, the SDRAM starts auto- refresh operation. (The auto-refresh is the same as the CBR refresh of conventional DRAMs.) During the auto-refresh operation, refresh address and bank select address are generated inside the SDRAM. For every auto-refresh cycle, the internal address counter is updated. Accordingly, 8192 cycles are required to refresh the entire memory contents. Before executing the auto-refresh command, all the banks must be in the IDLE state. In addition, since the precharge for all banks is automatically performed after auto-refresh, no precharge command is required after auto-refresh. Self Refresh entry (SELF):1 When this command is input during the IDLE state, the SDRAM starts self- refresh operation. After the execution of this command, self-refresh continues while CKE is Low. Since self- refresh is performed internally and automatically, external refresh operations are unnecessary. Power down mode entry: When this command is executed during the IDLE state, the SDRAM enters power down mode. In power down mode, power consumption is suppresses by cutting off the initial input circuit. Self-refresh exit: When this command is executed during self-refresh mode, the SDRAM can exit from self- refresh mode. After exiting from self-refresh mode, the SDRAM enters the IDLE state. Power down exit: When this command is executed at power down mode, the SDRAM can exit from power down mode. After exiting from power down mode, the SDRAM enters the IDLE state. 1. Do not use self refresh mode at temperatures above 70 °C. |
Similar Part No. - 48SD3208RPFI |
|
Similar Description - 48SD3208RPFI |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |