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XTR117 Datasheet(PDF) 2 Page - Texas Instruments |
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XTR117 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 11 page XTR117 SBOS344 − SEPTEMBER 2005 www.ti.com 2 ABSOLUTE MAXIMUM RATINGS(1) Power Supply, V+ (referenced to IO pin) +50V . . . . . . . . . . . . . . . . Input Voltage, (referenced to IRET pin) 0V to V+ . . . . . . . . . . . . . . . Output Current Limit Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . VREG, Short-Circuit Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Temperature Range −55 °C to +125°C . . . . . . . . . . . . . . . Storage Temperature Range −55 °C to +125°C . . . . . . . . . . . . . . . . . Junction Temperature +165 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD Rating (Human Body Model) 2000V . . . . . . . . . . . . . . . . . . . . . . . (Charged Device Model) 1000V . . . . . . . . . . . . . . . . . (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY XTR117 MSOP-8 DGK BOZ XTR117AIDGKT Tape and Reel, 250 XTR117 MSOP-8 DGK BOZ XTR117AIDGKR Tape and Reel, 2500 XTR117(2) DFN-8 DRB BOY XTR117AIDRBT Tape and Reel, 250 XTR117(2) DFN-8 DRB BOY XTR117AIDRBR Tape and Reel, 3000 (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. (2) Available Q1 2006. PIN ASSIGNMENTS Top View 1 2 3 4 8 7 6 5 1 2 3 4 8 7 6 5 Exposed Thermal Die Pad on Underside(2) DFN−8(3) MSOP−8 NC(1) I IN I RET I O NC(1) I IN I RET I O V REG V+ B(Base) E (Emitter) V REG V+ B(Base) E(Emitter) NOTES: (1) NC = No connection. Leave unconnected on PCB. (2) Connect thermal die pad to V −. (3) Available Q1 2006. XTR117 XTR117 |
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