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FMA246 Datasheet(PDF) 2 Page - Filtronic Compound Semiconductors |
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FMA246 Datasheet(HTML) 2 Page - Filtronic Compound Semiconductors |
2 / 4 page PRELIMINARY FMA246 HIGH-GAIN X-BAND MMIC Phone: +1 408 850-5790 www.filcs.com Revised: 7/28/04 Email: sales@filcsi.com ABSOLUTE MAXIMUM RATINGS1 Parameter Symbol Test Conditions Min Max Units Supply Voltage VDD For any operating current 8 V Supply Current IDD For VDD < 7V 75% IDSS mA RF Input Power PIN For standard bias conditions -8 dBm Storage Temperature TSTG Non-Operating Storage -40 150 ºC Total Power Dissipation PTOT See De-Rating Note below 1400 mW Gain Compression Comp. Under any bias conditions 5 dB Simultaneous Combination of Limits2 2 or more Max. Limits 80 % 1TAmbient = 22°C unless otherwise noted 2Users should avoid exceeding 80% of 2 or more Limits simultaneously Notes: • Operating conditions that exceed the Absolute Maximum Ratings will result in permanent damage to the device. • Total Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where: PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power • Total Power Dissipation to be de-rated as follows above 22 °C: PTOT = 1.4 - (0.004W/°C) x TCARRIER where TCARRIER = carrier or heatsink temperature above 22°C (coefficient of de-rating formula is the Thermal Conductivity) Example: For a 55 °C carrier temperature: PTOT = 1.4 - (0.004 x (55 – 22)) = 1.26W • For optimum heatsinking eutectic die attach is recommended; conductive epoxy die attach is acceptable with some degradation in thermal de-rating performance (PTOT = 550mW) • Note on Thermal Resistivity: The nominal value of 250 °C/W is stated for the input stage, which will reach temperature limits before the output stage. The aggregate MMIC thermal resistivity is approximately 80 °C/W. • HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A per ESD-STM5.1-1998, Human Body Model. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. |
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