11

ICL3207E, ICL3217E

Shrink Small Outline Plastic Packages (SSOP)

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.20mm

(0.0078 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “B” does not include dambar protrusion. Allowable dambar

protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-

sion at maximum material condition.

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

INDEX

AREA

E

D

N

12

3

-B-

0.25(0.010)

C A

M

BS

e

-A-

L

B

M

-C-

A1

A

SEATING PLANE

0.10(0.004)

C

H

µ

0.25(0.010)

B

M

M

α

0.25

0.010

GAUGE

PLANE

A2

24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

-

0.078

-

2.00

-

A1

0.002

-

0.05

-

-

A2

0.065

0.072

1.65

1.85

-

B

0.009

0.014

0.22

0.38

9

C

0.004

0.009

0.09

0.25

-

D

0.312

0.334

7.90

8.50

3

E

0.197

0.220

5.00

5.60

4

e

0.026 BSC

0.65 BSC

-

H

0.292

0.322

7.40

8.20

-

L

0.022

0.037

0.55

0.95

6

N24

24

7

α

-

Rev. 1

3/95