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SP723AB Datasheet(PDF) 2 Page - Littelfuse

Part # SP723AB
Description  TVS Diode Arrays - Electronic Protection Array for ESD and Overvoltage Protection
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Manufacturer  LITTELFUSE [Littelfuse]
Direct Link  http://www.littelfuse.com
Logo LITTELFUSE - Littelfuse

SP723AB Datasheet(HTML) 2 Page - Littelfuse

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TVS Diode Arrays
SP723
Electronic Protection Array for ESD and Overvoltage Protection
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specification TA =40oC to 105oC, VIN = 0.5VCC, Unless Otherwise Specified
Absolute Maximum Ratings
Continuous Supply Voltage, (V+) - (V-). ........................ +35V
Forward Peak Current, IIN to VCC, IIN to GND
(Refer to Figure 6). .................................±4A, 100µs
Peak Pulse Current, 8/20µs...................................±7A
ESD Ratings and Capability (Figure 1, Table 1)
Load Dump and Reverse Battery (Note 2)
Thermal Information
Thermal Resistance (Typical, Note 1)
θJA (
o
C/W)
PDIP Package . ...........................................160
SOIC Package . ..........................................170
Storage Temperature Range . ...........................-65oC to 150oC
Maximum Junction Temperature..............................150oC
Lead Temperature (Soldering 10s). ........................... 300oC
(SOIC - Lead Tips Only)
ESD Capability
ESD capability is dependent on the application and defined test
standard.The evaluation results for various test standards and methods
based on Figure 1 are shown in Table 1.
The SP723 has a Level 4 HBM capability when tested as a device to the
IEC 61000-4-2 standard. Level 4 specifies a required capability greater
than 8kV for direct discharge and greater than 15kV for air discharge.
For the “Modified” MIL-STD-3015.7 condition that is defined as an “in-
circuit” method of ESD testing, the V+ and V- pins have a return path to
ground and the SP723 ESD capability is typically greater than 25kV from
100pF through 1.5kΩ. By strict definition of MIL-STD-3015.7 using “pin-
to-pin” device testing, the ESD voltage capability is greater than 10kV.
For the SP723 EIAJ IC121 Machine Model (MM) standard, the ESD capa-
bility is typically greater than 2kV from 200pF with no series resistance.
STANDARD
TYPE/MODE
R D
CD
±VD
IEC 1000-4-2
(Level 4)
HBM, Air Discharge
330Ω 150pF 15kV
HBM, Direct Discharge
330Ω 150pF
8kV
MIL-STD-3015.7 Modified HBM
1.5kΩ 100pF 25kV
Standard HBM
1.5kΩ 100pF 10kV
EIAJ IC121
Machine Model
0kΩ
200pF
2kV
H.V.
SUPPLY
°±VD
IN
DUT
CD
R1
IEC 1000-4-2: R1 50 to 100MΩ
RD
CHARGE
SWITCH
DISCHARGE
SWITCH
MIL-STD-3015.7: R 1 1 to 10MΩ
FIGURE 1. ELECTROSTATIC DISCHARGE TEST
TABLE 1. ESD TEST CONDITIONS


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