www.littelfuse.com • +1 (800) 999-9445

©2005 Littelfuse • Telecom Design Guide

3

Mechanical Dimensions

Dimensions

Inches

Millimeters

Min

Typ

Max

Min

Typ

Max

A

0.114

0.118

0.122

2.900

3.000

3.100

B

0.114

0.118

0.122

2.900

3.000

3.100

C

0.075

0.079

0.083

1.900

2.000

2.100

E

0.011

0.015

0.019

0.285

0.385

0.485

F

0.076

0.080

0.084

1.930

2.030

2.130

H

0.035

0.039

0.043

0.900

1.000

1.100

J

0.000

0.004

0.008

0.000

0.100

0.200

K1

0.004

0.008

0.012

0.100

0.200

0.300

K2

0.004

0.008

0.012

0.100

0.200

0.300

M1

0.056

0.060

0.064

1.430

1.530

1.630

M2

0.038

0.042

0.046

0.970

1.070

1.170

N1

0.096

0.100

0.104

2.440

2.540

2.640

N2

0.082

0.086

0.090

2.080

2.180

2.280

2.54

(.100”)

H

1.50

(.059”)

1.27

(.050”)

Can be A or B

K1

N2

N1

END VIEW

SIDE VIEW

M2

M1

K2

F

E

C

J

B

A

TOP VIEW

BOTTOM VIEW

Recommended

Soldering Pad Outline

(Reference Only)

2.54

(.100”)

H

1.50

(.059”)

1.27

(.050”)

Can be A or B

K1

N2

N1

END VIEW

SIDE VIEW

M2

M1

K2

F

E

C

J

B

A

TOP VIEW

BOTTOM VIEW

Recommended

Soldering Pad Outline

(Reference Only)

Part Numbering

CONSTRUCTION VARIATION

0

P

: Single SIDACtor chip used

as a single device

PACKING STYLE

RP : Standard: Embossed carrier tape

SURGE Ipp Rating

A : 50AMP 10x560µs

B : 100AMP 10x560µs

PACKAGE TYPE

Q12 : QFN, 3.0mm x 3.0mm, two leaded package

L : RoHS Compliant

DEVICE TYPE

: SIDACtor

Pxxx0Q12ALRP

MEDIAN VOLTAGE

xxx : xxx volts

and reel per EIA 481-1, 12mm tape in 13” reel.

Device Marking

XXXX

YYYY

First Line: Product Name

Second Line: Lot number

Mechanical Drawings and Recommended Solder Pad Outline

*Reference Tech Brief

(EC642) for soldering

recommendations