NTHS2101P

http://onsemi.com

5

PACKAGE DIMENSIONS

ChipFET

CASE 1206A−03

ISSUE E

STYLE 1:

PIN 1. DRAIN

2. DRAIN

3. DRAIN

4. GATE

5. SOURCE

6. DRAIN

7. DRAIN

8. DRAIN

B

S

C

D

G

L

A

1

234

8

765

M

J

K

1

2

3

4

8

7

6

5

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

2.95

3.10

0.116

0.122

B

1.55

1.70

0.061

0.067

C

1.00

1.10

0.039

0.043

D

0.25

0.35

0.010

0.014

G

0.65 BSC

0.025 BSC

J

0.10

0.20

0.004

0.008

K

0.28

0.42

0.011

0.017

L

0.55 BSC

0.022 BSC

M

°

5 NOM

S

1.80

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM

PER SIDE.

4. LEADFRAME TO MOLDED BODY OFFSET IN

HORIZONTAL AND VERTICAL SHALL NOT EXCEED

0.08 MM.

5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE

BURRS.

6. NO MOLD FLASH ALLOWED ON THE TOP AND

BOTTOM LEAD SURFACE.

7. 1206A−01 AND 1206A−02 OBSOLETE. NEW

STANDARD IS 1206A−03.

0.05 (0.002)

°

5 NOM

2.00

0.072

0.080

Basic

Style 1

mm

inches

0.178

0.007

2.032

0.08

1.727

0.068

0.66

0.026

0.711

0.028

0.457

0.018

0.457

0.018

2.032

0.08

0.635

0.025

0.66

0.026

0.711

0.028

mm

inches

SCALE 20:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINTS*