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MC74LVX573M Datasheet(PDF) 4 Page - ON Semiconductor |
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MC74LVX573M Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 8 page MC74LVX573 http://onsemi.com 4 CAPACITIVE CHARACTERISTICS TA = 25°C TA = − 40 to 85°C Symbol Parameter Min Typ Max Min Max Unit Cin Input Capacitance 4 10 10 pF Cout Maximum 3−State Output Capacitance 6 pF CPD Power Dissipation Capacitance (Note 2) 29 pF 2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 8 (per latch). CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. NOISE CHARACTERISTICS (Input tr = tf = 3.0 ns, CL = 50 pF, VCC = 3.3 V, Measured in SOIC Package) TA = 25°C Symbol Characteristic Typ Max Unit VOLP Quiet Output Maximum Dynamic VOL 0.5 0.8 V VOLV Quiet Output Minimum Dynamic VOL −0.5 −0.8 V VIHD Minimum High Level Dynamic Input Voltage 2.0 V VILD Maximum Low Level Dynamic Input Voltage 0.8 V TIMING REQUIREMENTS (Input tr = tf = 3.0 ns) TA = 25°C TA = − 40 to 85°C Symbol Parameter Test Conditions Typ Limit Limit Unit tw(h) Minimum Pulse Width, LE VCC = 2.7 V VCC = 3.3 ± 0.3 V 6.5 5.0 7.5 5.0 ns tsu Minimum Setup Time, D to LE VCC = 2.7 V VCC = 3.3 ± 0.3 V 5.0 3.5 5.0 3.5 ns th Minimum Hold Time, D to LE VCC = 2.7 V VCC = 3.3 ± 0.3 V 1.5 1.5 1.5 1.5 ns ORDERING INFORMATION Device Package Shipping† MC74LVX573DWR2 SOIC−20 1000 / Tape & Reel MC74LVX573DWR2G SOIC−20 (Pb−Free) 1000 / Tape & Reel MC74LVX573DT TSSOP−20* 75 Units / Rail MC74LVX573DTR2 TSSOP−20* 2500 / Tape & Reel MC74LVX573M SOEIAJ−20 50 Units / Rail MC74LVX573MG SOEIAJ−20 (Pb−Free) 50 Units / Rail MC74LVX573MEL SOEIAJ−20 2000 / Tape & Reel MC74LVX573MELG SOEIAJ−20 (Pb−Free) 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. |
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