0464.500 datasheet(1/1 Pages) LITTELFUSE

Part #	0464.500

Description	Surface Mount Fuses - Subminiature Surface Mount

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Manufacturer	LITTELFUSE [Littelfuse]

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378

Surface Mount Fuses

www .littelfuse .com

Nominal

Catalog

Ampere

Voltage Cold Resistance

Melting I

2t

Number

Rating

(Ohms)

(A

2 sec)

0464.500

0.5

250

0.283

0.3

0464 001.

1.0

250

0.100

0.8

0464 1.25

1.25

250

0.059

1.2

0464 01.6

1.6

250

0.048

1.9

0464 002.

2.0

250

0.038

2.8

0464 02.5

2.5

250

0.032

4.5

0464 3.15

3.15

250

0.024

9.4

0464 004.

4.0

250

0.018

15.1

0464 005.

5.0

250

0.014

23.1

0464 06.3

6.3

250

0.011

40.0

*For information and availability of additional ratings please contact Littelfuse

• The Surface Mount Nano2 250V UMF product family complies with IEC

Publication IEC 60127-4-Universal Modular Fuse-Links [UMF]. This

IEC standard has been accepted by UL/CSA making it the first global

fuse standard.

• The Nano2 250V UMF fuse family is based on the proven NANO2

Fuse product technology.

• Product is RoHS Compliant and compatible with lead-free solders and

higher temperature profiles.

ELECTRICAL CHARACTERISTICS:

% of Ampere

Opening

Rating

Time

125%

1 hour, Minimum

200%

2 minutes, Maximum

1000%

0.001 sec, Min; 0.01 sec Max

AGENCY APPROVALS: Listed to IEC 60127-4, Universal Modular Fuse-

Links (UMF), 250V. UL Listed. Approved by METI and CCC. K and VDE

AGENCY FILE NUMBERS: UL E184655. METI NBK30502-E184655a,b.

INTERRUPTING RATINGS: 100 amperes at 250VAC

ENVIRONMENTAL SPECIFICATIONS:

Operating Temperature: –55°C to 125°C.

Shock: MIL-STD-202, Method 213, Test Condition A.

Vibration: MIL-STD-202, Method 201 (10–55 Hz).

Insulation Resistance (After Opening): IEC60127-4 (0.1MΩ min

@ 500VDC).

Resistance to Soldering Heat: IEC60127-4.

Thermal Shock: MIL-STD-202, Method 107,

Test Condition B (–65 to 125°C, 5 cycles).

Moisture Resistance: MIL-STD-202, Method 106

PHYSICAL SPECIFICATIONS:

Materials: Body: High Performance Ceramic

Terminations: Silver plated brass.

Soldering Parameters:

Wave Solder — 260°C, 10 seconds maximum

Reflow Solder — 260°C, 30 seconds maximum

Solderability: IEC60127-4.

PACKAGING SPECIFICATIONS: 24mm Tape and Reel per

EIA-RS481-1 (IEC 286, part 3); 1,500 per reel, add packaging suffix, DR.

PATENTED

ORDERING INFORMATION:

Reference Dimensions:

REFLOW SOLDER

F

2.8

(.11")

12.1

(.475")

4.5

(.177")

6.7

(.264")

6.8

(.264")

WAVE SOLDER

3.5

(.14")

AC250V

F500mAL

6.9

(.27")

5.6

(.22")

5.6

(.22")

4.5

(.177")

Height

END CAP

TOP VIEW

Subminiature Surface Mount

NANO

2® 250V UMF FUSE Fast-Acting 464 Series

100

10

1

0.1

0.01

0.001

1

10

1000

0.1

CURRENT IN AMPERES

Average Time Current Curves

RoHS

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