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CONNECTION DIAGRAMS

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

HTSSOP PACKAGE (PWP −16)

UCD8620 (TOP VIEW)

NC − No internal connection

NC

CLK

3V3

ISET

AGND

CTRL

CLF

ILIM

VIN

NC

VDD

PVDD

OUT1

OUT2

PGND

CS

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

HTSSOP PACKAGE (PWP −16)

UCD8220 (TOP VIEW)

NC − No internal connection

NC

CLK

3V3

ISET

AGND

CTRL

CLF

ILIM

NC

NC

VDD

PVDD

OUT1

OUT2

PGND

CS

NC

ILIM

NC

CS

NC

QFN PACKAGE (RGW−20)

UCD8620 (BOTTOM VIEW)

20

19

18

17

16

6

7

8

9

10

CLK

NC

NC

VIN

NC

15 14 13 12 11

1

2

3

4

5

16

15

14

13

CLK

NC

NC

VDD

QFN PACKAGE (RSA−16)

UCD8220 (BOTTOM VIEW)

5

6

7

8

1

CLF

ILIM

NC

CS

2

3

4

12

11

10

9

UCD8220, UCD8620

SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005

These devices have limited built-in ESD protection. The leads should be shorted together or the device

placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

110-V HV STARTUP

TEMPERATURE RANGE

PowerPAD™

CIRCUIT

QFN-20 (RGW)

HTSSOP-16 (PWP)

-40°C to 105°C

No

UCD8220PWP

UCD8220RSA

-

Yes

-

UCD8620RGW

(1)

HTSSOP-16 (PWP), QFN-16 (RSA), and QFN-20 (RGW) packages are available taped and reeled. Add R suffix to device type (e.g.

UCD8620PWPR) to order quantities of 2,000 devices per reel for the PWP package and 1,000 devices per reel for the RSA and RGW

packages.

(2)

These products are packaged in Pb-Free and Green lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C to 260°C

peak reflow temperature to be compatible with either lead free or Sn/Pb soldering operations.

(3)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(4)

Contact factory for availability of QFN packaging.

(5)

Product preview stage of development.

4