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FAN5069EMTCX Datasheet(PDF) 4 Page - Fairchild Semiconductor |
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FAN5069EMTCX Datasheet(HTML) 4 Page - Fairchild Semiconductor |
4 / 20 page 4 www.fairchildsemi.com FAN5069 Rev. 1.1.0 Absolute Maximum Ratings (Note1) Thermal Information Recommended Operating Conditions Notes: 1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified all other voltages are referenced to AGND. 2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model). 3. Junction to ambient thermal resistance, θ JA, is a strong function of PCB material, board thickness, thickness and number of copper planes, number of vias used, diameter of vias used, available copper surface, and attached heat sink characteristics. Parameter Min. Max. Unit VCC to PGND 6V BOOT to PGND 33 V SW to PGND Continuous -0.5 33 V Transient (t < 50nS, F < 500kHz) -3 33 V HDRV (VBOOT--VSW) 6V LDRV -0.5 6 V All Other Pins -0.3 VCC+0.3 V Maximum Shunt Current for VCC 150 mA Electrostatic Discharge Protection (ESD) Level (Note 2) HBM 2 kV CDM 0.4 Parameter Min. Typ. Max. Unit Storage Temperature -65 150 °C Lead Soldering Temperature, 10 Seconds 300 °C Vapor Phase, 60 Second 215 °C Infrared, 15 Seconds 220 °C Power Dissipation (PD), TA = 25°C 715 mW Thermal Resistance- Junction to Case( θ JC)37 °C/W Thermal Resistance- Junction to Ambient ( θ JA) (Note 3) 100 °C/W Parameter Conditions Min. Typ. Max. Unit Supply Voltage (VCC)VCC to GND 4.5 5 5.5 V Ambient Temperature (TA) Commercial -10 85 °C Industrial -40 85 °C Junction Temperature (TJ) 125 °C |
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