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EL5623IRZ-T7 Datasheet(PDF) 5 Page - Intersil Corporation |
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EL5623IRZ-T7 Datasheet(HTML) 5 Page - Intersil Corporation |
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5 / 7 page  5 FN7507.1 May 6, 2005 FIGURE 7. PSRR vs FREQUENCY FIGURE 8. OVERSHOOT vs CAPACITANCE LOAD FIGURE 9. SETTLING TIME vs STEP SIZE FIGURE 10. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves PSRR+ VS=±7.5V RL=1kΩ CL=1.5pF PSRR- 1K 10K 100K 1M 10M FREQUENCY (Hz) 20 0 -20 -60 -80 -40 VS=±7.5V RL=10kΩ VOPP=1V 0 500 1K 1.5K 2K CLOAD (pF) 60 50 40 10 0 20 30 VS=±7.5V RL=10kΩ CL=8pF BUFFER 23456 STEP SIZE (+V) 800 700 500 300 200 400 600 0 50 75 100 125 AMBIENT TEMPERATURE (°C) 1.4 1 0.6 0.2 0 0.4 0.8 25 85 1.2 JEDEC JESD51-7 - HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 1.031W θ JA =9 7°C /W TS SO P16 0 50 75 100 125 AMBIENT TEMPERATURE (°C) 0.9 0.7 0.5 0.3 0 0.4 0.6 25 85 0.8 JEDEC JESD51-3 - LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.2 0.1 676mW θ JA =1 48° C/W TSS OP 16 EL5623 |
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