8

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FN7394.1

December 22, 2004

Where:

• i = Channel 1 to 4

and Figure 11 provide a convenient way to see if the device

will overheat. The maximum safe power dissipation can be

found graphically, based on the package type and the

ambient temperature. By using the previous equation, it is a

derating curves. To ensure proper operation, it is important

to observe the recommended derating curves shown in

Figures 10 and 11.

FIGURE 10. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

Unused Amplifiers

It is recommended that any unused amplifiers be configured

as a unity gain follower. The inverting input should be directly

connected to the output and the non-inverting input tied to

the ground plane.

Power Supply Bypassing and Printed Circuit

Board Layout

The EL5412 can provide gain at high frequency. As with any

high-frequency device, good printed circuit board layout is

necessary for optimum performance. Ground plane

construction is highly recommended, lead lengths should be

as short as possible and the power supply pins must be well

bypassed to reduce the risk of oscillation. For normal single

connected in parallel, placed in the region of the amplifier.

One 4.7µF capacitor may be used for multiple devices. This

same capacitor combination should be placed at each

supply pin to ground if split supplies are to be used.

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD - HTSSOP

EXPOSED DIEPAD SOLDERED TO PCB PER

JESD51-5

3.5

3

2.5

1.5

1

0.5

0

0

255075

100

150

AMBIENT TEMPERATURE (°C)

125

85

2

2.632W

θ

38°

C/W

HT

SS

OP

14

100

MAX

00°C/W

1.0W

TSSOP

14

400

800

0

1200

1000

600

200

PACKAGE MOUNTED ON A JEDEC JESD51-3

LOW EFFECTIVE THERMAL CONDUCTIVITY

TEST BOARD

606mW

θ

5°C

/W

TSS

OP1

4

MAX

50

150

AMBIENT TEMPERATURE (°C)

100

025

75

125

85

694mW

θ

44°C

/W

HT

SS

OP

14

EL5412