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MC34166T Datasheet(PDF) 8 Page - ON Semiconductor |
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MC34166T Datasheet(HTML) 8 Page - ON Semiconductor |
8 / 20 page MC34166, MC33166 http://onsemi.com 8 Switch Output The output transistor is designed to switch a maximum of 40 V, with a minimum peak collector current of 3.3 A. When configured for step–down or voltage–inverting applications, as in Figures 19 and 23, the inductor will forward bias the output rectifier when the switch turns off. Rectifiers with a high forward voltage drop or long turn–on delay time should not be used. If the emitter is allowed to go sufficiently negative, collector current will flow, causing additional device heating and reduced conversion efficiency. Figure 9 shows that by clamping the emitter to 0.5 V, the collector current will be in the range of 100 µA over temperature. A 1N5822 or equivalent Schottky barrier rectifier is recommended to fulfill these requirements. Undervoltage Lockout An Undervoltage Lockout comparator has been incorporated to guarantee that the integrated circuit is fully functional before the output stage is enabled. The internal 5.05 V reference is monitored by the comparator which enables the output stage when VCC exceeds 5.9 V. To prevent erratic output switching as the threshold is crossed, 0.9 V of hysteresis is provided. Thermal Protection Internal Thermal Shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 170 °C, the latch is forced into a ‘reset’ state, disabling the output switch. This feature is provided to prevent catastrophic failures from accidental device overheating. It is not intended to be used as a substitute for proper heatsinking. The MC34166 is contained in a 5–lead TO–220 type package. The tab of the package is common with the center pin (Pin 3) and is normally connected to ground. DESIGN CONSIDERATIONS Do not attempt to construct a converter on wire–wrap or plug–in prototype boards. Special care should be taken to separate ground paths from signal currents and ground paths from load currents. All high current loops should be kept as short as possible using heavy copper runs to minimize ringing and radiated EMI. For best operation, a tight component layout is recommended. Capacitors CIN, CO, and all feedback components should be placed as close to the IC as physically possible. It is also imperative that the Schottky diode connected to the Switch Output be located as close to the IC as possible. |
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