3

FN8177.2

September 9, 2005

X9313UM-3*

13UD

3 to 5.5

50

0 to 70

8 Ld MSOP

X9313UMZ-3* (Note)

DDD

0 to 70

8 Ld MSOP (Pb-free)

X9313UMI-3*

13UE

-40 to 85

8 Ld MSOP

X9313UMIZ-3* (Note)

13UE Z

-40 to 85

8 Ld MSOP (Pb-free)

X9313UP-3

X9313UP D

0 to 70

8 Ld PDIP

X9313US-3*

X9313U D

0 to 70

8 Ld SOIC

X9313USZ-3* (Note)

X9313U Z D

0 to 70

8 Ld SOIC (Pb-free)

X9313WM-3*

13WD

10

0 to 70

8 Ld MSOP

X9313WMZ-3* (Note)

DDG

0 to 70

8 Ld MSOP (Pb-free)

X9313WMI-3*

13WE

-40 to 85

8 Ld MSOP

X9313WMIZ-3* (Note)

13WE Z

-40 to 85

8 Ld MSOP (Pb-free)

X9313WP-3

X9313WP D

0 to 70

8 Ld PDIP

X9313WS-3*

X9313W D

0 to 70

8 Ld SOIC

X9313WSZ-3* (Note)

X9313W Z D

0 to 70

8 Ld SOIC (Pb-free)

X9313ZM-3*

13ZD

1

0 to 70

8 Ld MSOP

X9313ZMZ-3* (Note)

DDK

0 to 70

8 Ld MSOP (Pb-free)

X9313ZMI-3*

13ZE

-40 to 85

8 Ld MSOP

X9313ZMIZ-3* (Note)

13ZE Z

-40 to 85

8 Ld MSOP (Pb-free)

X9313ZP-3

X9313ZP D

0 to 70

8 Ld PDIP

X9313ZS-3*

X9313Z D

0 to 70

8 Ld SOIC

X9313ZSZ-3* (Note)

X9313Z Z D

0 to 70

8 Ld SOIC (Pb-free)

X9313ZSI-3*

X9313Z E

-40 to 85

8 Ld SOIC

X9313ZSIZ-3* (Note)

X9313Z Z E

-40 to 85

8 Ld SOIC (Pb-free)

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

*Add "T1" suffix for tape and reel.

PART NUMBER

PART MARKING

(V)

(k

Ω)

TEMPERATURE

RANGE

(°C)

PACKAGE

X9313