MC33201, MC33202, MC33204, NCV33202, NCV33204

http://onsemi.com

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DETAILED OPERATING DESCRIPTION

General Information

The MC33201/2/4 family of operational amplifiers are

unique in their ability to swing rail−to−rail on both the input

and the output with a completely bipolar design. This offers

low noise, high output current capability and a wide

common mode input voltage range even with low supply

voltages. Operation is guaranteed over an extended

temperature range and at supply voltages of 2.0 V, 3.3 V and

5.0 V and ground.

Since the common mode input voltage range extends from

voltage supplies. The MC33201/2/4 are guaranteed not to

latch or phase reverse over the entire common mode range,

however, the inputs should not be allowed to exceed

maximum ratings.

Circuit Information

Rail−to−rail performance is achieved at the input of the

amplifiers by using parallel NPN−PNP differential input

stages. When the inputs are within 800 mV of the negative

rail, the PNP stage is on. When the inputs are more than 800

input pairs will cause a reversal of input bias currents (see

Figure 6). Also, slight differences in offset voltage may be

noted between the NPN and PNP pairs. Cross−coupling

techniques have been used to keep this change to a minimum.

In addition to its rail−to−rail performance, the output stage

is current boosted to provide 80 mA of output current,

enabling the op amp to drive 600

W loads. Because of this

high output current capability, care should be taken not to

exceed the 150

°C maximum junction temperature.

t, TIME (10

ms/DIV)

Figure 26. Noninverting Amplifier Slew Rate

Figure 27. Small Signal Transient Response

t, TIME (5.0

ms/DIV)

Figure 28. Large Signal Transient Response

t, TIME (10

ms/DIV)

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self−align when subjected to a

solder reflow process.