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M38747MBF-XXXFS Datasheet(PDF) 9 Page - Mitsubishi Electric Semiconductor |
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M38747MBF-XXXFS Datasheet(HTML) 9 Page - Mitsubishi Electric Semiconductor |
9 / 92 page 9 3874 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER MITSUBISHI MICROCOMPUTERS GROUP EXPANSION (Extended operating temperature version) The 3874 group (extended operating temperature version) is de- signed for automotive comfort and amusement control such as audio, air-conditioner etc., household appliances, and other con- sumer applications. Mitsubishi plans to expand the 3874 group (extended operating temperature version) as follows: Memory Type Support for mask ROM, One Time PROM, and EPROM versions Memory Size ROM/PROM size ............................................... 48 K to 60 K bytes RAM size .......................................................... 1024 to 2048 bytes Packages 80P6S-A .................................. 0.65 mm-pitch plastic molded QFP 80D0 ....................... 0.8 mm-pitch ceramic LCC (EPROM version) Fig. 6 Memory expansion plan (Extended operating temperature version) Currently planning products are listed below. RAM size (bytes) Remarks Package Table 3 Support products Product name As of March 1998 61440 (61310) 49152 (49022) (P) ROM size (bytes) ROM size for User in ( ) Memory Expansion Plan of 3874 group (Extended operating temperature version) Products under development or planning : the development schedule and specification may be revised without notice. Planning products may be stopped during the development. M38749EFDGP M38749EFFS M38749MFF M38747MCF 2048 80P6S-A 80D0 One Time PROM version (blank) 1024 80P6S-A EPROM version (for software development, operat- ing temperature = –20 to 85°C) Mask ROM version 32K 1024 60K ROM size (bytes) RAM size (byte) 1536 2048 36K 40K 44K 48K 52K 56K 28K 24K 16K 20K Mass product Mass product M38749MFF/EFD M38747MCF |
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