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BS616LV2019DIG55 Datasheet(PDF) 8 Page - Brilliance Semiconductor |
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BS616LV2019DIG55 Datasheet(HTML) 8 Page - Brilliance Semiconductor |
8 / 10 page Revision 1.2 May 2004 8 R0201-BS616LV2019 ORDERING INFORMATION BSI BS616LV2019 PACKAGE DIMENSIONS 48 mini-BGA (6 x 8) D1 VIEW A 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS. BALL PITCH e = 0.75 D 8.0 6.0 EN 48 3.75 E1 D1 5.25 NOTES: Note: BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments. BS616LV2019 X X Z Y Y GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC SPEED 55: 55ns 70: 70ns PKG MATERIAL -: Normal G: Green P: Pb free PACKAGE T: TSOP1-48 A: BGA-48-0608 D: DICE |
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