Revision 1.2

May

2004

8

R0201-BS616LV2019

ORDERING INFORMATION

BSI

BS616LV2019

PACKAGE DIMENSIONS

48 mini-BGA (6 x 8)

D1

VIEW A

1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.

2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.

3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.

BALL PITCH e = 0.75

D

8.0

6.0

EN

48

3.75

E1

D1

5.25

NOTES:

Note:

BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products

for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support

systems and critical medical instruments.

BS616LV2019 X X

Z

Y Y

GRADE

SPEED

55: 55ns

70: 70ns

PKG MATERIAL

-: Normal

G: Green

P: Pb free

PACKAGE

T: TSOP1-48

A: BGA-48-0608

D: DICE