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TLC5941RHBRG4 Datasheet(PDF) 2 Page - Texas Instruments

Part # TLC5941RHBRG4
Description  16-CHANNEL LED DRIVER WITH DOT CORRECTION AND GRAYSCALE PWM CONTROL
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLC5941RHBRG4 Datasheet(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS.
TLC5941
SLVS589 – JULY 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TA
PACKAGE(1)
PART NUMBER
–40
°C to 85°C
28-pin HTSSOP PowerPAD™
TLC5941PWP
–40
°C to 85°C
32-pin 5 mm x 5 mm QFN
TLC5941RHB
–40
°C to 85°C
28-pin PDIP
TLC5941NT
(1)
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI Web site at www.ti.com.
over operating free-air temperature range (unless otherwise noted)(1)
UNIT
VI
Input voltage range(2)
VCC
–0.3 V to 6 V
IO
Output current (dc)
90 mA
VI
Input voltage range
V(BLANK), V(SCLK), V(XLAT), V(MODE)
–0.3 V to VCC +0.3 V
V(SOUT), V(XERR)
–0.3 V to VCC +0.3 V
VO
Output voltage range
V(OUT0) to V(OUT15)
–0.3 V to 18 V
HBM (JEDEC JESD22-A114,
2 kV
Human Body Model)
ESD rating
CDM (JEDEC JESD22-C101,
500 V
Charged Device Model)
Tstg
Storage temperature range
–55
°C to 150°C
TA
Operating ambient temperature range
–40
°C to 85°C
HTSSOP (PWP)(4)
31.58
°C/W
Package thermal impedance(3)
QFN (RHB)(4)
35.9
°C/W
PDIP (NT)
48
°C/W
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
The package thermal impedance is calculated in accordance with JESD 51-7.
(4)
With PowerPAD soldered on PCB with 2-oz. trace of copper. See TI application report SLMA002 for further information.
2


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