Data Sheet G15506EJ2V0DS

10

µµµµPC3018, 3025

RECOMMENDED SOLDERING CONDITIONS

The

µPC3018, 3025 should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact our sales representative.

Type of Surface Mount Device

µµµµPC3018TJ, µµµµPC3025TJ: MP-3Z (5 pin)

Process

Conditions

Symbol

Infrared Ray Reflow

Peak temperature: 235°C,

Reflow time: 30 seconds or less (at 210°C or higher),

Maximum number of reflow processes: 3 times or less.

IR35-00-3

Vapor Phase Soldering

Peak temperature: 215°C,

Reflow time: 40 seconds or less (at 200°C or higher),

Maximum number of reflow processes: 3 times or less.

VP15-00-3

Wave Soldering

Solder temperature: 260°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120°C MAX. (Package surface temperature).

WS60-00-1

Partial Heating Method

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each side of the device).

–

Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the

device will be damaged by heat stress.

Remark It is recommended to use a rosin-type flux with a low chlorine element (chlorine: 0.2 Wt% or less).

Type of Through-hole Device

µµµµPC3018HB, µµµµPC3025HB: MP-3 (5 pin)

Process

Conditions

Wave Soldering

(only to leads)

Solder temperature: 260°C or below,

Flow time: 10 seconds or less

Partial Heating Method

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each pin).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that

the package body does not get jet soldered.