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CY7C1363B-133BZC Datasheet(PDF) 11 Page - Cypress Semiconductor

Part # CY7C1363B-133BZC
Description  9-Mbit (256K x 36/512K x 18) Flow-Through SRAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1363B-133BZC Datasheet(HTML) 11 Page - Cypress Semiconductor

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CY7C1361B
CY7C1363B
Document #: 38-05302 Rev. *B
Page 11 of 34
ADSC
85
85
B4
A8
Input-
Synchronous
Address Strobe from Controller,
sampled on the rising edge of CLK,
active LOW. When asserted LOW,
addresses presented to the device are
captured in the address registers. A[1:0] are
also loaded into the burst counter. When
ADSP and ADSC are both asserted, only
ADSP is recognized.
ZZ
64
64
T7
H11
Input-
Asynchronous
ZZ “sleep” Input, active HIGH. When
asserted HIGH places the device in a
non-time-critical “sleep” condition with data
integrity preserved. For normal operation,
this pin has to be LOW or left floating. ZZ pin
has an internal pull-down.
DQs
58,59,62,63,
68,69,72,73,
8,9,12,13,
18,19,22,23
58,59,62,63,
68,69,72,73,
8,9,12,13,
18,19,22,23
P7,K7,G7,
E7,F6,H6,
L6,N6,D1,
H1,L1,N1,
E2,G2,K2,
M2
J10,K10,
L10,M10,
D11,E11,
F11,G11,J1,
K1,L1,M1,
D2,E2,F2,
G2
I/O-
Synchronous
Bidirectional Data I/O lines. As inputs,
they feed into an on-chip data register that
is triggered by the rising edge of CLK. As
outputs, they deliver the data contained in
the memory location specified by the
addresses presented during the previous
clock rise of the read cycle. The direction of
the pins is controlled by OE. When OE is
asserted LOW, the pins behave as outputs.
When HIGH, DQs and DQP[A:B] are placed
in a three-state condition.The outputs are
automatically three-stated during the data
portion of a write sequence, during the first
clock when emerging from a deselected
state, and when the device is deselected,
regardless of the state of OE.
DQP[A:B]
74,24
74,24
D6,P2
C11,N1
I/O-
Synchronous
Bidirectional Data Parity I/O Lines.
Functionally, these signals are identical to
DQs. During write sequences, DQP[A:B] is
controlled by BW[A:B] correspondingly.
MODE
31
31
R3
R1
Input-Static
Selects Burst Order. When tied to GND
selects linear burst sequence. When tied to
VDD or left floating selects interleaved burst
sequence. This is a strap pin and should
remain static during device operation. Mode
Pin has an internal pull-up.
VDD
15,41,65,91 15,41,65,91 C4,J2,J4,
J6,R4
D4,D8,E4,
E8,F4,F8,
G4,G8,
H4,H8,J4,
J8,K4,K8,
L4,L8,M4,
M8
Power Supply Power supply inputs to the core of the
device.
VDDQ
4,11,20,27,
54,61,70,77
4,11,20,27,
54,61,70,77
A1,A7,F1,
F7,J1,J7,
M1,M7,U1
,U7
C3,C9,D3,
D9,E3,E9,
F3,F9,G3,
G9,J3,J9,
K3,K9,L3,
L9,M3,M9,
N3,N9
I/O Power
Supply
Power supply for the I/O circuitry.
CY7C1363B: Pin Definitions (continued)
Name
TQFP
(3-Chip
Enable)
TQFP
(2-Chip
Enable)
BGA
(2-Chip
Enable)
fBGA
(3-Chip
Enable)
I/O
Description


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