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133

ETQW

Vishay Roederstein

Document Number 42075

Revision 15-Aug-02

For technical questions, contact eurotant@vishay.com

DESIGNATION

SYMBOL

DIMENSIONS (mm)

Holding tape width

W

18.0 (+ 1 / - 0.5)

Adhesive tape width

W0

Min. 5.0

Distance of components

P

12.7 ± 1

Hole center to component center

P2

6.35 ± 1.3

Hole center to lead

P1

5.1 / 3.8 ± 0.7

Distance of body to hole center

H*)

18.0 (+ 2 / - 0)

Distance of lead to hole center

H0

16.0 ± 0.5

Component upper edge to hole center

H1

Max. 32.0

Adhesive tape location

W2

Max. 3.0

Hole location

W1

9.0 (+ 0.75 / - 0.5)

Distance of holes

P0

12.7 ± 0.3

Hole diameter

D0

4.0 ± 0.3

Lead diameter

d

0.5 ± 0.05

Component alignement

∆h

Max. ± 2.0

Pitch

F

2.5 / 5.0 (+ 0.6 / - 0.1)

Holding tape thickness

t

0.5 ± 0.2

Component alignement

∆P

Max. ± 1.3

Length of snipped leads

L

Max. 11.0

TAPING ACCORDING TO IEC 286-2

(*) also available : 16mm and 20mm taping according to DIN-IEC 286 part 2

∆h

W2

D0

H0

W0

W1

W

t

P1

P2

H2

F

P

∆P

P2

P

P1

F

P0

L

H

Unreeling direction

Resin-Coated, Radial-Leaded

Tantalum Capacitors