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NTB18N06LT4 Datasheet(PDF) 7 Page - ON Semiconductor |
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NTB18N06LT4 Datasheet(HTML) 7 Page - ON Semiconductor |
7 / 12 page NTP18N06L, NTB18N06L http://onsemi.com 7 INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. mm inches 0.33 8.38 0.04 1.016 0.63 17.02 0.42 10.66 0.12 3.05 0.24 6.096 |
Similar Part No. - NTB18N06LT4 |
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Similar Description - NTB18N06LT4 |
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