BSI

BH616UV8010

R0201-BH616UV8010

Revision

1.0

Jul.

2005

9

n ORDERING INFORMATION

Note:

Brilliance Semiconductor Inc. (BSI) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not

authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in

significant injury or death, including life-support systems and critical medical instruments.

n PACKAGE DIMENSIONS

n

PACKAGE

T: TSOP 1-48

A: BGA-48-0608

D:DICE

BH616UV8010

X

X

Z

Y Y

GRADE

I: -25

SPEED

70: 70ns

PKG MATERIAL

-: Normal

G: Green

48 mini-BGA (6 x 8)

D1

VIEW A

1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.

2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.

3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.

BALL PITCH e = 0.75

D

8.0

6.0

E

N

48

3.75

E1

D1

5.25

NOTES: