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ADS8381I Datasheet(PDF) 2 Page - Texas Instruments |
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ADS8381I Datasheet(HTML) 2 Page - Texas Instruments |
2 / 35 page ADS8381 SLAS364D − APRIL 2002 − REVISED FEBRUARY 2005 www.ti.com 2 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION MODEL MAXIMUM INTEGRAL LINEARITY (LSB) MAXIMUM DIFFERENTIAL LINEARITY (LSB) NO MISSING CODES RESOLU- TION (BIT) PACKAGE TYPE PACKAGE DESIGNATOR TEMPER- ATURE RANGE ORDERING INFORMATION TRANS- PORT MEDIA QUANTITY ADS8381I ±6 −2/3 17 48 Pin PFB −40 °C to ADS8381IPFBT Tape and reel 250 ADS8381I ±6 −2/3 17 48 Pin TQFP PFB −40 C to 85 °C ADS8381IPFBR Tape and reel 1000 ADS8381IB ±5 −1/2 18 48 Pin PFB −40 °C to ADS8381IBPFBT Tape and reel 250 ADS8381IB ±5 −1/2 18 48 Pin TQFP PFB −40 C to 85 °C ADS8381IBPFBR Tape and reel 1000 NOTE: For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UNIT Voltage +IN to AGND −0.4 V to +VA + 0.1 V Voltage −IN to AGND −0.4 V to 0.5 V +VA to AGND −0.3 V to 7 V Voltage range +VBD to BDGND −0.3 V to 7 V Voltage range +VA to +VBD −0.3 V to 2.55 V Digital input voltage to BDGND −0.3 V to +VBD + 0.3 V Digital output voltage to BDGND −0.3 V to +VBD + 0.3 V Operating free-air temperature range, TA −40 °C to 85°C Storage temperature range, Tstg −65 °C to 150°C Junction temperature (TJ max) 150 °C TQFP package Power dissipation (TJMax − TA)/θJA TQFP package θJA thermal impedance 86 °C/W Lead temperature, soldering Vapor phase (60 sec) 215 °C Lead temperature, soldering Infrared (15 sec) 220 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. |
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