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FTR-B2MA4.5Z Datasheet(PDF) 7 Page - Fujitsu Component Limited. |
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FTR-B2MA4.5Z Datasheet(HTML) 7 Page - Fujitsu Component Limited. |
7 / 8 page 7 FTR-B2 Series NOT FOR NEW DESIGN 1. General Information q Relays produced after the specific date code that is indicated on each data sheet are lead-free now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info. (http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf) q Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays. q Most signal and some power relays also comply with RoHS. Please refer to individual data sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE). q It has been verified that using lead-free relays in leaded assembly process will not cause any problems (compatible). q “LF” is marked on each outer and inner carton. (No marking on individual relays). q To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office. We will ship leaded relays as long as the leaded relay inventory exists. 2. Recommended Lead Free Solder Profile q Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005) RoHS Compliance and Lead Free Relay Information Reflow Solder condtion 3. Moisture Sensitivity q Moisture Sensitivity Level standard is not applicable to electromechanical realys. 4. Tin Whisker q SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house test. 5. Solid State Relays q Each lead terminal will be changed from solder plating to Sn plating and Nickel plating. A layer of Nickel plating is between the terminal and the Sn plating to avoid whisker. We highly recommend that you confirm your actual solder conditions Flow Solder condtion: Pre-heating: maximum 120˚C Soldering: dip within 5 sec. at 260˚C soler bath Solder by Soldering Iron: Soldering Iron Temperature: maximum 360˚C Duration: maximum 3 sec. max. 120 sec. 90~120 sec. 20~30 sec. (duration) Cooling Pre-heating Soldering Peak Temp.: max. 250˚C 250 220 130 170 |
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