7

FTR-B2 Series

NOT

FOR

NEW

DESIGN

1. General Information

q

Relays produced after the specific date code that is indicated on each data sheet are lead-free

now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.

(http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf)

q

Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward

Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays.

q

Most signal and some power relays also comply with RoHS. Please refer to individual data

sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that

are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE).

q

It has been verified that using lead-free relays in leaded assembly process will not cause any

problems (compatible).

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“LF” is marked on each outer and inner carton. (No marking on individual relays).

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To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.

We will ship leaded relays as long as the leaded relay inventory exists.

2. Recommended Lead Free Solder Profile

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Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005)

RoHS Compliance and Lead Free Relay Information

Reflow Solder condtion

3. Moisture Sensitivity

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Moisture Sensitivity Level standard is not applicable to electromechanical realys.

4. Tin Whisker

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SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house

test.

5. Solid State Relays

q

Each lead terminal will be changed from solder plating to Sn plating and Nickel plating. A layer of Nickel plating

is between the terminal and the Sn plating to avoid whisker.

We highly recommend that you confirm your actual solder conditions

Flow Solder condtion:

Pre-heating:

maximum 120˚C

Soldering:

dip within 5 sec. at

260˚C soler bath

Solder by Soldering Iron:

Soldering Iron

Temperature:

maximum 360˚C

Duration:

maximum 3 sec.

max. 120 sec.

90~120 sec.

20~30 sec.

(duration)

Cooling

Pre-heating

Soldering

Peak Temp.: max. 250˚C

250

220

130

170