MICROCIRCUIT DATA SHEET

MNLMH6628-X-RH REV 0A0

(Absolute Maximum Ratings)

(Note 1)

Supply Voltage

+7V dc

Maximum Junction temperature

(Note 2)

+175 C

Lead temperature

+300 C

Soldering, 10 seconds

Differential input voltage

V+ - V-

Common mode input voltage

V+ - V-

Storage temperature range

-65 C < Ta < +150 C

Power Dissipation

(Note 2)

1.0W

Short circuit current

(Note 3)

Thermal Resistance

ThetaJA

135 C/W

Ceramic DIP

(Still Air)

75 C/W

(500LF/Min Air Flow)

200 C/W

Ceramic SOIC

(Still Air)

145 C/W

(500LF/Min Air Flow)

ThetaJC

30 C/W

Ceramic DIP

19 C/W

Ceramic SOIC

Package Weight

(typical)

TBD

Ceramic DIP

TBD

Ceramic SOIC

ESD Tolerance

(Note 4)

4000V

Note 1:

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.

Operating Ratings indicate conditions for which the device is intended to be

functional, but do not guarantee specific performance limits. For guaranteed

specifications and test conditions, see the Electrical Characteristics. The

guaranteed specifications apply only for the test conditions listed. Some performance

characteristics may degrade when the device is not operated under the listed test

conditions.

Note 2:

The maximum power dissipation must be derated at elevated temperatures and is

dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to

ambient thermal resistance), and TA (ambient temperatuer). The maximum allowable

power dissipation at any temperatuer is Pdmax = (Tjmax -TA) / ThetaJA or the number

given in the Absoulute Maximum Ratings, whichever is lower.

Note 3:

Output is short circuit protected to ground, however maximum reliability is obtained

if output current does not exceed 160mA.

Note 4:

Human body model, 1.5k Ohms in series with 100pF.

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