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G911T25D Datasheet(PDF) 2 Page - Global Mixed-mode Technology Inc |
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G911T25D Datasheet(HTML) 2 Page - Global Mixed-mode Technology Inc |
2 / 9 page Ver: 6.6 Sep 25, 2002 TEL: 886-3-5788833 http://www.gmt.com.tw 2 G910/G911 Global Mixed-mode Technology Inc. Absolute Maximum Ratings (Note 1) Input Voltage………………………………………….10V Power Dissipation Internally Limited (Note2) Maximum Junction Temperature…………………150°C Storage Temperature Range..……-65°C ≤ TJ ≤+150°C Lead Temperature, Time for Wave Soldering SOT89, SOT223, µTO92 Package……..…...260°C, 4s Continuous Power Dissipation (TA = + 25°C) SOT 89 (1)………………………….…………………..0.5W SOT 223 (1)……………………….……………………0.8W µTO 92 & TO 92 (1)…………….……………………..0.5W Note (1): See Recommended Minimum Footprint. Operating Conditions (Note 1) Input Voltage…………………………..…..………4V ~ 7V Temperature Range………………….….0°C ≤ TJ ≤125°C Electrical Characteristics VIN =5V, IO = 400mA/250mA+, CIN=10µF, COUT =10µF. All specifications apply for TA = TJ = 25°C.[Note 3] PARAMETER CONDITIONS MIN TYP MAX UNITS 5mA < IO <400mA Output Voltage 5mA < IO <250mA + 3.234 3.3 3.366 V Line Regulation 4V < VIN < 7V, IO = 10mA 10 30 mV 10mA < IO < 400mA 42 60 Load Regulation 10mA < IO <250mA + 28 45 mV Output Impedance 100mA DC and 100mA AC, fO = 120Hz 102 m Ω Quiescent Current VIN = 5V 0.6 mA Ripple Rejection fi = 120 Hz, 1VP-P, Io = 100mA 42 dB IO = 400mA 0.65 IO =250mA + 0.35 V Dropout Voltage IO = 50mA 50 100 mV VIN = 4.5V, mounted on SOT 89 rec- ommended minimum footprint 400 Output Current Continuous Test TA = 25°C, TJ < 125°C, VOUT within ±2% (Note 2) VIN = 5.2V, µTO 92 & TO 92 package 0.53 inch leads soldered to PC Board 250+ mA Short Circuit Current 0.77 A Over Temperature 125 °C [ + for µTO-92 & TO-92 Package] Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed speci- fications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resis- tance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the G910 in SOT 89 package & µTO 92,TO 92, θJA is 250°C/W and in the SOT-223 package is 156°C/W (See Recommended Minimum Footprint). The safe operation in SOT 89,µTO 92,TO 92 & SOT 223 package, it can see “Typical Performance Characteristics” (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum. Definitions Dropout Voltage The input/output Voltage differential at which the regu- lator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load cur- rent and minimum input supply requirements. Line Regulation The change in output voltage for a change in input volt- age. The measurement is made under conditions of low dissipation or by using pulse techniques such that av- erage chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measure- ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem- perature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. |
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