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AM30LV0064DJ40 Datasheet(PDF) 8 Page - Advanced Micro Devices |
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AM30LV0064DJ40 Datasheet(HTML) 8 Page - Advanced Micro Devices |
8 / 41 page 8 Am30LV0064D CONNECTION DIAGRAMS (Continued) Note: The ball grid array is depopulated to 40 signal balls. The maximum package height is 1.2 mm. The 9 x 9 x 9 x 9 outrigger balls (shaded) may be required for higher density devices in larger packages. The shaded ball region should be treated as a “keep out” area with pads placed to allow larger devices to be accommodated. Special Handling Instructions Special handling is required for Flash Memory prod- ucts in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compro- mised if the package body is exposed to temperatures above 150 °C for prolonged periods of time. A B CDE F G HJ K 1 2 3 4 5 6 0.8 0.8 0.8 0.8 1.6 0.8 Ø0.400 mm 0.250 SMD, Ball = 0.3 mm NC VCC NC NC NC NC NC NC VCCQ NC NC CE# RE# RY/BY# SE# IO7 IO6 IO5 IO4 NC NC CLE ALE WE# WP# IO0 IO1 IO2 IO3 NC NC VSS NC NC RFU NC NC NC VSS NC 15 mm 40-Ball FBGA Top View, Balls Facing Down |
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Similar Description - AM30LV0064DJ40 |
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