NTHS5443

http://onsemi.com

5

PACKAGE DIMENSIONS

ChipFET

t

CASE 1206A−03

ISSUE G

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

E

A

b

e

e1

D

1

234

8

765

c

L

1

2

3

4

8

7

6

5

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM PER SIDE.

4. LEADFRAME TO MOLDED BODY OFFSET IN HORIZONTAL

AND VERTICAL SHALL NOT EXCEED 0.08 MM.

5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE BURRS.

6. NO MOLD FLASH ALLOWED ON THE TOP AND BOTTOM LEAD

SURFACE.

0.05 (0.002)

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

1.00

1.05

1.10

0.039

INCHES

b

0.25

0.30

0.35

0.010

c

0.10

0.15

0.20

0.004

D

2.95

3.05

3.10

0.116

E

1.55

1.65

1.70

0.061

e

0.65 BSC

e1

0.55 BSC

L

0.28

0.35

0.42

0.011

0.041

0.043

0.012

0.014

0.006

0.008

0.120

0.122

0.065

0.067

0.025 BSC

0.022 BSC

0.014

0.017

NOM

MAX

1.80

1.90

2.00

0.071

0.075

0.079

5

° NOM

q

5

° NOM

q

STYLE 1:

PIN 1. DRAIN

2. DRAIN

3. DRAIN

4. GATE

5. SOURCE

6. DRAIN

7. DRAIN

8. DRAIN

0.457

0.018

2.032

0.08

0.635

0.025

0.66

0.026

0.711

0.028

mm

inches

SCALE 20:1

0.178

0.007

2.032

0.08

1.727

0.068

0.66

0.026

0.711

0.028

mm

inches

SCALE 20:1

Styles 1 and 4

Basic

0.457

0.018

SOLDERING FOOTPRINT*