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AEDR-8310-1Q2 Datasheet(PDF) 9 Page - Agilent(Hewlett-Packard) |
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AEDR-8310-1Q2 Datasheet(HTML) 9 Page - Agilent(Hewlett-Packard) |
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9 / 10 page  9 Mounting Center 0.72 1.96 1.08 0.94 Note: The shaded areas are the leads for soldering. Note: The shaded areas are not encoder pin-outs. They are electrically grounded and physically exposed. PCB layout with tracks running across these areas should be avoided. Recommended Land Pattern for AEDR-8300 Series Recommended Lead-free Reflow Soldering Temperature Profile 0 50 100 150 200 250 300 TIME (sec.) 60 - 150 sec 125 °C Cool Down Heat up Solder Paste Dry Solder Reflow 120 sec max 40 °C 10 - 20 sec 255 °C 250 °C 217 °C Preheat Temperature 40 °C to 125°C = 120 sec max Temperature maintain above 217 °C = 60-150 sec Peak Temperature = 255 ± 5°C Time above 250 °C = 10-20 sec Note: Due to treatment of high temperature, AEDR-8300 trans- parent compound is expected to turn yellow after IR reflow. |
Similar Part No. - AEDR-8310-1Q2 |
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Similar Description - AEDR-8310-1Q2 |
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