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MSM6422 Datasheet(PDF) 9 Page - OKI electronic componets |
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MSM6422 Datasheet(HTML) 9 Page - OKI electronic componets |
9 / 10 page 9/10 MSM6422 ¡ Semiconductor (Unit : mm) PACKAGE DIMENSIONS DIP24-P-600-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 3.55 TYP. |
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