GE28F320B3BC70 datasheet(10/58 Pages) INTEL

Part #	GE28F320B3BC70

Description	3 Volt Advanced Boot Block Flash Memory

Download	58 Pages

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Manufacturer	INTEL [Intel Corporation]

Direct Link	http://www.intel.com

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10 / 58 page

28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

4

3UHOLPLQDU\

0580_02

NOTE: Lower densities will have NC on the upper address pins. For example, an 16-Mbit device will have NC

on Pins 9 and 10.

0580_04

NOTES:

1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the

upper address solder balls. Routing is not recommended in this area. A20 is the upgrade address for the

16-Mbit device.

2. 4-Mbit density not available in

µBGA* CSP.

Figure 2. 48-Lead TSOP Package for x16 Configurations

Advanced Boot Block

48-Lead TSOP

12 mm x 20 mm

TOP VIEW

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

A

16

V

CCQ

GND

DQ

15

DQ

7

DQ

14

DQ

6

DQ

13

DQ

5

DQ

12

DQ

4

V

CC

DQ

11

DQ

3

DQ

10

DQ

2

DQ

9

DQ

1

DQ

8

DQ

0

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

A

15

A

14

A

13

A

12

A

11

A

10

A

9

A

8

A

21

A

20

WE#

RP#

V

PP

WP#

A

19

A

18

A

17

A

7

A

6

A

5

21

22

23

24

OE#

GND

CE#

A

0

28

27

26

25

A

4

A

3

A

2

A

1

32 M

16 M

64 M

Figure 3. x8 48-Ball µBGA* Chip Size Package (Top View, Ball Down)

A

14

A

15

A

16

A

17

V

CCQ

A

12

A

10

A

13

NC

A

11

A

8

WE#

A

9

D

5

D

6

V

PP

RP#

NC

WP#

A

19

D

2

D

3

A

20

A

18

A

6

NC

A

7

A

5

A

3

CE#

D

0

A

4

A

2

A

1

A

0

GND

D

7

NC

D

4

V

CC

NC

D

1

OE#

A

B

C

D

E

F

13

25

47

68

16M

8M

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GE28F320B3BC70 Datasheet(PDF) 10 Page - Intel Corporation

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