Fairchild Semiconductor Product Package Material Disclosure

Materials Disclosure Disclaimer

The information provided in this Materials Disclosure is, to our knowledge, correct. However, there is no guarantee to completeness

or accuracy, as some information is derived from data sources outside the company. Also, there may not be information included in

this statement regarding the minute amounts of dopant and metal materials contained within the electrically active or passive devices

contained within the finished product.

Package Type

TSSOP-56

Weight of

Package (grams)

Maximum

Minimum

2.21E-01

2.08E-01

Component

Material

Weight in

grams

Substance in

material

Wt% in

finished

product min

Wt% in

finished

product max

CAS #

33.34

35.41

Copper

32.08

33.66

7440-50-8

Nickel

1.00

1.06

7439-89-6

Silicon

0.22

0.23

7440-66-6

Magnesium

0.05

0.05

7439-95-4

Silver (DP)

0.00

0.40

7440-22-4

Lead Frame

Copper alloy

7.37E-02

58.07

61.66

Silica

35.92

47.89

Carbon Black

0.00

0.90

Resin

8.98

20.65

Antimony

Compound

0.30

1.80

1309-64-4

Brominated

Compound

0.90

2.39

68541-56-0

Encapsulation

Epoxy

1.28E-01

1.37

6.87

Tin

1.17

5.84

7440-31-5

Solder

8.84E-03

Lead

0.21

1.03

7439-92-1

1.37

6.87

Tin

1.37

6.87

7440-31-5

Plating

or

Lead-free

Solder

8.84E-03

0.84

0.93

Silicon and trace

metals

0.84

0.93

7440-21-3

Chip

Silicon and

inorganic

compounds

1.90E-03

0.10

0.11

Silver

0.07

0.08

7440-22-4

Resin

0.02

0.03

Die Attach

Adhesive

2.22E-04

0.62

0.68

Gold

0.62

0.68

7440-57-5

Wire Bond

Gold Wire

1.39E-03