International Airport Industrial Park

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Mailing Address: PO Box 11400

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Tucson, AZ 85734

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Street Address: 6730 S. Tucson Blvd.

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Tucson, AZ 85706

Tel: (520) 746-1111

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Twx: 910-952-1111

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Cable: BBRCORP

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Telex: 066-6491

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FAX: (520) 889-1510

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Immediate Product Info: (800) 548-6132

100MS

EMI SHIELD

FIGURE 1. Cross-Sectional Side View of 100MS.

FIGURE 2. Assembly Diagram.

DESCRIPTION

The 100MS is an epoxy encapsulated electromagnetic/

electrostatic interference (EMI) shield for use with

circuits where sensitivity to EMI is critical. It was

designed to attenuate EMI by converting electromag-

netic field energy into heat that is absorbed by the

shield and by shunting electrostatic fields to common.

The 100MS may be used in applications to either

confine or exclude EMI. Its cavity was designed for

28.45mm x 28.45mm x 7.24mm, 20-pin hybrid pack-

ages. The shields in the cover and base plate are in two

separate halves to maintain the electrical isolation

between the adjacent rows of pins of the module it

encloses. Because of the spacing between the shield

halves and epoxy flow holes, the 100MS provides a

partial, but adequate low reluctance path for electro-

magnetic flux. The 100MS is well suited for use with

isolation modules such as the Burr-Brown 3656, 722,

and 724.

ASSEMBLY INSTRUCTIONS

Assemble the base plate to the module by pushing the

pins of the module through the beveled holes in the

base plate until the base plate and bottom of the

module are in contact with each other. Place the cover

over the module so the tabs are aligned and fit into the

slots in the base plate. Bend the four wide shield

soldering tabs protruding from the cover to make

contact with the bare metal on the base plate. Solder

these four tabs to insure the integrity of their connec-

tion to the base plate.

The 100MS and the module it contains are mounted

and secured to a printed circuit board (PCB) by solder-

ing the two narrow PCB solder tabs to the appropriate

common. The PCB solder tab closest to the input side

of the module should be soldered to the input com-

mon. The other tab should be soldered to the output

common. Figure 2 illustrates the assembly of the

100MS.

Base Plate

Module

(reference only)

PCB Solder Tab

Shield Solder Tab

Cover

Shield

Solder Tab

V

ISO

Epoxy Encapsulant

Connection to

Input Common

Connection to

Output Common

V

Base Plate Shield

Half Cover Shield

Half Cover Shield

®

© 1979 Burr-Brown Corporation

PDS-421A

Printed in U.S.A. October, 1993

SBFS013