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SN74LVC1404DCURE4 Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC1404DCURE4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 16 page www.ti.com FEATURES A 3 2 5 8 1 CTRL VCC XOUT GND DCT PACKAGE (TOP VIEW) YEP OR YZP PACKAGE (BOTTOM VIEW) DCU PACKAGE (TOP VIEW) 3 2 4 5 1 CTRL VCC OSCOUT XOUT GND XOUT GND VCC Y XIN See mechanical drawings for dimensions. 2 5 3 4 8 XIN A Y XIN OSCOUT Y 4 6 7 6 7 8 6 1 7 CTRL A OSCOUT DESCRIPTION/ORDERING INFORMATION SN74LVC1404 OSCILLATOR DRIVER FOR CRYSTAL OSCILLATOR OR CERAMIC RESONATOR SCES469C – AUGUST 2003 – REVISED JULY 2005 • Available in the Texas Instruments • Low Power Consumption (10- µA Max I CC) in NanoStar™ and NanoFree™ Packages Standby State • Supports 5-V V CC Operation • ±24-mA Output Drive at 3.3 V • Inputs Accept Voltages to 5.5 V • I off Supports Partial-Power-Down Mode Operation • One Buffered Inverter With Schmitt-Trigger Input and Two Unbuffered Inverters • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • Integrated Solution for Oscillator Applications • ESD Protection Exceeds JESD 22 • Suitable for Commonly Used Clock Frequencies: – 2000-V Human-Body Model (A114-A) – 15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz, – 200-V Machine Model (A115-A) 25 MHz, 26 MHz, 27 MHz, 28 MHz – 1000-V Charged-Device Model (C101) • Control Input to Disable the Oscillator Circuit This device consists of one inverter with a Schmitt-trigger input and two unbuffered inverters. It is designed for 1.65-V to 5.5-V VCC operation. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) SN74LVC1404YEPR 0.23-mm Large Bump – YEP Tape and reel _ _ _44_ NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP SN74LVC1404YZPR –40 °C to 85°C (Pb-free) SSOP – DCT Tape and reel SN74LVC1404DCTR CA4_ _ _ VSSOP – DCU Tape and reel SN74LVC1404DCUR CA4_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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