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MAX8521 Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX8521
Description  Smallest TEC Power Drivers for Optical Modules
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX8521 Datasheet(HTML) 2 Page - Maxim Integrated Products

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Smallest TEC Power Drivers for
Optical Modules
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
SHDN, MAXV, MAXIP, MAXIN,
CTLI to GND .........................................................-0.3V to +6V
COMP, FREQ, OS1, OS2, CS, REF,
ITEC to GND...........................................-0.3V to (VDD + 0.3V)
PVDD1, PVDD2 to GND...............................-0.3V to (VDD + 0.3V)
PVDD1, PVDD2 to VDD ...........................................-0.3V to +0.3V
PGND1, PGND2 to GND .......................................-0.3V to +0.3V
COMP, REF, ITEC Short to GND ...................................Indefinite
LX Current (Note 1) ........................................±2.25A LX Current
Continuous Power Dissipation (TA = +70°C)
20-Pin 5mm x 5mm x 0.9mm QFN (derate 20.8mW/°C
above +70°C) (Note 2)...................................................1.67W
3mm x 3mm UCSP (derate 22mW/°C
above +70°C).................................................................1.75W
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering 10s) ..................................+300°C
ELECTRICAL CHARACTERISTICS
(VDD = PVDD1 = PVDD2 = SHDN = 5V, 1MHz mode (Note 3). PGND1 = PGND2 = GND, CTLI = MAXV = MAXIP = MAXIN = REF,
TA = 0°C to +85°C, unless otherwise noted. Typical values at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Input Supply Range
VDD
3.0
5.5
V
Maximum TEC Current
±1.5
A
Reference Voltage
VREF
VDD = 3V to 5.5V, IREF = 150µA
1.485
1.5
1.515
V
Reference Load Regulation
∆VREF
VDD = 3V to 5V, IREF = 10µA to 1mA
1.2
5.0
mV
VMAXI_ = VREF
140
150
160
VDD = 5V
VMAXI_ = VREF/3
40
50
60
VMAXI_ = VREF
143
150
155
MAXIP/MAXIN Threshold
Accuracy
VDD = 3V
VMAXI_ = VREF/3
45
50
55
mV
VDD = 5V, I = 0.2A
0.09
0.14
NFET On-Resistance
RDS(ON-N)
VDD = 3V, I = 0.2A
0.11
0.16
VDD = 5V, I = 0.2A
0.14
0.23
PFET On-Resistance
RDS(ON-P)
VDD = 3V, I = 0.2A
0.17
0.30
VLX = VDD = 5V, TA = +25
°C
0.03
4
NFET Leakage
ILEAK(N)
VLX = VDD = 5V, TA = +85
°C
0.3
µA
VLX = 0, TA = +25
°C
0.03
4
PFET Leakage
ILEAK(P)
VLX = 0, TA = +85
°C
0.3
µA
500kHz mode
11
14
VCOMP = VREF =
1.500V, VDD = 5V
1MHz mode
16
21
500kHz mode
8
11
No-Load Supply Current
IDD(NO
LOAD)
VCOMP = VREF =
1.500V, VDD = 3.3V
1MHz mode
11
14
mA
Shutdown Supply Current
IDD-SD
SHDN = GND, VDD = 5V (Note 4)
2
3
mA
Thermal Shutdown
TSHUTDOWN Hysteresis = 15
°C
+165
°C
VDD rising
2.50
2.65
2.80
UVLO Threshold
VUVLO
VDD falling
2.40
2.55
2.70
V
Note 1: LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should take care not to exceed
the IC’s package power dissipation limits.
Note 2: Solder underside metal slug to PC board ground plane.


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