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HCPL-814 Datasheet(PDF) 3 Page - Agilent(Hewlett-Packard)

Part No. HCPL-814
Description  AC Input Phototransistor Optocoupler High Density Mounting Type
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Maker  HP [Agilent(Hewlett-Packard)]
Homepage  http://www.home.agilent.com
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3
HCPL-814-300E
Solder Reflow Temperature Profile
1) One-time soldering reflow is
recommended within the
condition of temperature and
time profile shown at right.
2) When using another soldering
method such as infrared ray
lamp, the temperature may rise
partially in the mold of the
device. Keep the temperature on
the package of the device within
the condition of (1) above.
30 seconds
60 ~ 150 sec
90 sec
60 sec
60 sec
25
°C
150
°C
200
°C
250
°C
260
°C (Peak Temperature)
217
°C
Time (sec)
Absolute Maximum Ratings
Parameters
Symbol
Min.
Max.
Units
Storage Temperature
TS
–55
125
˚C
Ambient Operating Temperature
TA
–30
100
˚C
Lead Solder Temperature for 10s
Tsol
260
˚C
(1.6 mm below seating plane)
Average Forward Current
IF
±50
mA
Input Power Dissipation
PI
70
mW
Collector Current
IC
50
mA
Collector-Emitter Voltage
VCEO
35
V
Emitter-Collector Voltage
VECO
6V
Collector Power Dissipation
PC
150
mW
Total Power Dissipation
Ptot
200
mW
Isolation Voltage
Viso
5000
Vrms
(AC for 1 minute, R.H. = 40 ~ 60%)[1]
6.5
± 0.5
(0.256)
DIMENSIONS IN MILLIMETERS AND (INCHES)
4.6
± 0.5
(0.181)
2.54
± 0.25
(0.1)
3.5
± 0.5
(0.138)
7.62
± 0.3
(0.3)
0.26
(0.010)
10.16
± 0.3
(0.4)
1.2
± 0.1
(0.047)
0.35
± 0.25
(0.014)
1.0
± 0.25
(0.039)
A 814
YW W
DATE CODE *1
RANK *2
LEAD FREE
ANODE




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