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HSDL-3003 Datasheet(PDF) 13 Page - Agilent(Hewlett-Packard) |
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HSDL-3003 Datasheet(HTML) 13 Page - Agilent(Hewlett-Packard) |
13 / 21 page 13 Appendix A: SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil Figure 16. Stencil and PCBA. 1.1 Recommended Land Pattern Figure 17. Land pattern. METAL STENCIL FOR SOLDER PASTE PRINTING LAND PATTERN PCBA STENCIL APERTURE SOLDER MASK 0.60 1.25 1.75 1.35 0.475 1.425 2.375 3.325 CL MOUNTING CENTER SHIELD SOLDER PAD 2.05 0.775 0.10 FIDUCIAL |
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